Technology

cross-posted from: https://piefed.world/c/tech/p/1255250/state-senator-pockets-massive-real-estate-fee-from-a-30m-data-center-land-sale-then-intr

Personally, I have never seen this many issues with Windows like today. Even way back in the Windows Vista days. Woah, Windows Vista will be 20 years old in November...

If you are forced to still be on Windows 11.

This file can be found in the following directory,

C:\ProgramData\Microsoft\Windows\CapabilityAccessManager\

Then see if it shows a huge file size.

Windows Latest found that one particular file called “CapabilityAccessManager.db-wal” can use most of your system storage.

If your PC is affected, the safest fix is to install Windows 11 KB5095093 from Windows Update, or wait for the July 2026 Patch Tuesday update, where the fix is expected to roll out automatically.

cross-posted from: https://piefed.world/c/tech/p/1255260/bank-of-england-handed-powers-to-regulate-key-tech-firms-including-amazon-and-google

cross-posted from: https://piefed.world/c/tech/p/1255245/ai-surveillance-is-being-supercharged-and-it-will-chill-social-progress

Lobsters.

https://www.tradingview.com/news/cointelegraph:9e6975706094b:0-eu-parliament-passes-chat-control-allowing-private-chat-scans-until-2028/

Thiel was a cofounder of payments group PayPal and Palantir, a defence contractor known for mass surveillance and criticised heavily for its “strategic partnership” with the Israel Defense Forces (IDF) in its assault on Gaza.

A leaked schedule for the “retreat” hosted by Dialog, an invitation-only group cofounded 20 years ago by Thiel and entrepreneur Auren Hoffman, featured discussions on topics including preparations for a third world war, battlefield technologies, nuclear energy and cult-building.

Totally normal, nothing to see here. Just a business meeting!

Apple on Friday accused OpenAI of stealing secrets about products still in development, setting up a legal face-off between two of the world’s biggest tech companies.

In a lawsuit filed in U.S. District Court for the Northern District of California, the consumer tech giant said that OpenAI, a leader in artificial intelligence that has a new hardware business, had asked job candidates from Apple to share details about secret projects and to bring device components and prototypes to their interviews.

Apple also accused an OpenAI employee of downloading internal documents from a laptop owned by the iPhone maker.

OpenAI used the confidential information to approach Apple’s manufacturing partners, including asking one partner to demonstrate Apple’s technique for finishing metal on its devices, the lawsuit says.

cross-posted from: https://piefed.world/c/tech/p/1254121/mayor-mamdani-announces-landmark-click-to-cancel-consumer-protection-rules-to-ban-subscr

Another Atlantic article that appears to hit.

The TLDR is if you seek higher cognition and use AI as a tool alongside that practice you’ll be fine. If you lean on AI to avoid cognition then you’ll backslide into the primordial goo as a person.

cross-posted from: https://scribe.disroot.org/post/10041321

Infineon Technologies has opened its Smart Power Fab in Dresden, Germany, months ahead of schedule, bringing the world’s largest manufacturing facility for intelligent power semiconductors and analog/mixed-signal technologies into operation.

The facility represents a €5 billion (about $5.7 billion) investment, the largest in the company’s history. It creates 1,000 direct jobs and doubles Infineon’s manufacturing capacity in Dresden.

The factory will produce chips that improve how electricity is converted and managed. Those devices will support AI data centers. They will also help power electricity grids and software-defined vehicles.

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cross-posted from: https://piefed.world/c/tech/p/1252818/connecting-an-lg-monitor-to-a-windows-pc-trigger-the-silent-unprompted-installation-of-a

cross-posted from: https://scribe.disroot.org/post/10041431

Taiwan Semiconductor Manufacturing Company (TSMC) announced on Saturday a major research partnership with a prominent European nanoelectronics research institute. The collaboration will focus on developing advanced 3D integrated circuit (IC) packaging technologies to meet the demands of next-generation high-performance computing and artificial intelligence chips.

The joint research program will utilize the European institute’s specialized cleanroom facilities and TSMC’s state-of-the-art silicon fabrication expertise. By stacking semiconductor layers vertically, 3D packaging technology allows for significantly faster data transmission speeds, reduced power consumption, and increased transistor density compared to traditional flat, 2D chip layouts.

This partnership comes as major semiconductor manufacturers race to overcome the physical limitations of traditional silicon scaling. Advanced packaging has emerged as a critical technological frontier, with major tech firms investing heavily in proprietary architectures to support complex, multi-layered chip designs required for hyperscale data centers.

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Archived