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submitted 1 week ago by limerod@reddthat.com to c/android@lemdro.id
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[-] limerod@reddthat.com 10 points 1 week ago

TL;DR

  • Samsung is reportedly working on a new cooling solution for future Exynos smartphone processors.
  • This packaging tech is apparently derived from PCs and servers and sees a type of heatsink attached to the top of the processor.
  • Work on the tech could be completed by Q4 2024, suggesting the Exynos 2500 could potentially use it.
[-] ForgotAboutDre@lemmy.world 6 points 1 week ago

Rather than make better processors they just make them dispate heat better.

These are also googles ‘own design processors’, so bad Samsung even avoids useing exynos. Next gen pixels will definitely be the hottest phone around.

[-] limerod@reddthat.com 1 points 1 week ago

If it was easy to make better processors everyone would be doing that. The exynos 2400 improved much more compared to previous generations. Better heat spread will mean improved performance and thermals. As for efficiency newer nodes should improve on this front.

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this post was submitted on 04 Jul 2024
28 points (93.8% liked)

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