submitted 8 months ago by fuckwit_mcbumcrumble@lemmy.world to c/technology@lemmy.world

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[-] TheGrandNagus@lemmy.world 4 points 8 months ago

For years. 2017 if you argue the separate CCXs in Zen1 Threadripper to be chiplets.

2019 with Zen2 if you're not counting that.

AMD is pretty ahead of everyone when it comes to packaging tech.

[-] SharkAttak@kbin.social 3 points 8 months ago

Next thing they'll declare to be the first to use 3D packaging in their CPUs.

this post was submitted on 15 Dec 2023

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