this has got to be a troll post. right? RIGHT?!
as you pointed out, just get rid of the air gaps with the absolute minimal amount of paste.
my back woods method
ensure your heat sink does not have pre-applied paste or a pad. apply a small amount of paste. cut the thickness with the short edge of an old credit card at about a 30° angle, using just enough pressure to bend the card slightly so the smooth surface of the card presses paste into voids and the trailing edge of the card removes excess to level the surface - you will likely still be able to make out some chip package markings through the paste. remove all edge excess and spillage. fit your heat sink. done.

did your article measure aging? assuming you didn't fry your PC with the excess paste, there is no edge seal on voids when you use too much. over time most paste will dry and crack, creating new voids and hot spots. there is a difference between hour old transfer compound and 2 year old compound.