Hardware

It's not a matter of if; rather when.

No relief in sight for RAM buyers.

A new DARPA- and Texas-backed facility will focus on 3D heterogeneous integration, stacking, and combining multiple materials and chip types to advance U.S. capabilities in defense, AI, and HPC.

Archived version: https://archive.is/newest/https://www.tomshardware.com/darpa-invests-1-4-billion-to-build-texas-foundry-for-next-gen-3d-chip-integration

New quantum hardware and software upgrades put IBM on track for a 2026 quantum advantage claim

Archived version: https://archive.is/newest/https://www.tomshardware.com/tech-industry/semiconductors/ibm-unveils-new-120-qubit-processor-and-software-stack

SteamOS-powered cube for your TV targets early 2026 launch, no pricing details.

SteamOS-powered headset sports semi-modular design, wireless “low-latency” PC streaming.

If you want to build an actual HAL 9000, all you need is an LED, some carpentry skills, and any laptop accessing a talking AI. If you want to build your own R2D2, you’ll have a tougher job assembling a range of materials, motors, and electronics. But what if you wanted to make your own working version of TARS, that bizarre, blocky robot from Christopher Nolan’s Interstellar that looks like a stainless steel ATM with metal posts for legs sprouting from its shoulders?

New components make it more useful and powerful but no less odd.

Microsoft has detailed a new Azure AI datacenter site in Atlanta, which will connect to its Wisconsin site and existing supercomputers.

Supply will remain deficient for a few years.

Jalisco plans to develop the first state-owned chip design park in Latin America to expand Mexico’s semiconductor production capacity.

But chipmakers already know this empirically.

Following development

Link to official blog post (somehow still blames people for correctly understanding their first statements)

Of Note:

• No dates were specified, No commitments made.

• Day 1 game support was not promised, just individual game support.

• They still plan on splitting the development for RDNA1 and RDNA2 from RDNA3 and RDNA4 development, giving only the latter support for new features.

Bolt talks the software behind its upcoming GPU; AI not mentioned once

RISC-V is an industry standard, like USB or Wi-Fi. The specifications are publicly available under the Creative Commons license and every engineer, wherever they are in the world, can use them to design their products locally, while engaging with the global RISC-V ecosystem.

This standard is defined by RISC-V International and its members. Decisions are voted upon collectively, ensuring every member is heard. It’s a model that has worked for us for many years, ensuring any updates to the RISC-V ISA happen transparently, without breaking existing designs, and always in service of the broader ecosystem.

The RISC-V ISA is already an industry standard and the next step is impartial recognition from a trusted international organization.

Today, I’m excited to announce that we have taken that first step. RISC-V International has been approved as a recognized PAS (that’s publicly available specification) Submitter by the ISO/IEC Joint Technical Committee (JTC 1).

This means we’re able to submit draft international papers, starting with the The RISC-V Instruction Set Manual, for consideration as true, international standards.

Fungi make up a massive, interconnected part of Earth’s ecosystems, yet they’re vastly underrepresented in research and public consciousness compared to plants and animals. That may change in the future though, as a group of researchers at The Ohio State University have found a way to use fungi as organic memristors — hinting at a possible future where fungal networks help power our computing devices.

But will they beat AMD's and Nvidia's offerings?

The top model, with an AMD Ryzen 7 chip, has many modern features - and a Blu-ray drive - built in.